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eight-channel constant current sink with current match AP3609 preliminary datasheet 1 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited general description the AP3609 is an eight-channel constant current sink with current match used for led driver. it uses an external resistor to set the current for eight led strings with an accuracy of 1.5%. the full scale led current can be adjusted from 10ma to 100ma for each chan- nel. the led light can be adjusted by pwm dimming function. the device can keep working when led opens with- out damage. it features under voltage lockout protec- tion and over temperature protection. the AP3609 has two interface terminals (fb and fbx). they enable the device to be connected in paral- lel. the AP3609 is available in soic-16 package. features input voltage range: 4.2v to 5.5v typical output current: 480ma (60ma/1v per channel) maximum output current: 800ma (100ma/1.5v per channel) current match accuracy: 1.5% pwm dimming control open led self-check and protection under voltage lockout protection over temperature protection enable parallel application applications notebook lcd display modules lcd monitor lcd tv figure 1. package type of AP3609 soic-16
eight-channel constant current sink with current match AP3609 preliminary datasheet 2 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 2. pin configuration of AP3609 (top view) pin configuration (soic-16) m package pin number pin name function 1, 2, 3, 4, 6, 7, 8, 9 ch1 to ch8 white led cathode connection pin. these pins should be connected to gnd if not used 5 p gnd ground pin. it would be useful when connected with pgnd and exposed pad 10 pwm pwm dimming control pin. adding a pwm signal to this pin to control led dimming (see figure 10 for detail dimming control mode). if not used, connect it to the high level 11 fbx this pin is an interface terminal. connecting it with fb pin can achieve parallel applica- tion. if not used, leave it unconnected 12 iset led current set pin. an external resistor is connected to this pin to set the current of each channel according to i channel =1.194*400/r iset 13 fb feedback pin. this pin is an interface terminal, which samples the voltage of each channel, and outputs the lowest voltage of the string to dc/dc converter 14 agnd g round pin. it would be useful when connected with pgnd and exposed pad 15 vcc input voltage pin 16 en enable pin. logic high enables the ic and logic low disables the ic pin description ch7 ch8 ch6 ch5 ch4 ch3 ch2 ch1 pwm iset fb agnd vcc en fbx pgnd 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9
eight-channel constant current sink with current match AP3609 3 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited preliminary datasheet functional block diagram figure 3. functional block diagram of AP3609 pwm dimming dff bandgap uvlo en otp en logic time out 3v 100mv ch1 fb ch2 8 100:1 iset current sink en current sink current sink ch3 current sink ch4 current sink ch5 current sink ch6 current sink ch7 current sink ch8 ch2 min.(ch1...ch8,fbx) ch3 ch4 c h5ch6ch7 ch8 v cc max.(ch1...ch8) stg (short to gnd) comp en 100mv test ch1...ch8 8 ch1...ch8 v ref en 8 ch1 vcc gnd pwm 16 v ref v cc + opa 4 fbx 1 10 11 12 13 5, 14 15 16 9 8 7 6 4 3 2
eight-channel constant current sink with current match AP3609 preliminary datasheet 4 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited ordering information package temperature range part number marking id packing type soic-16 -40 to 85 o c AP3609mtr-g1 AP3609m-g1 tape & reel circuit type package m: soic-16 g1: green AP3609 - tr: tape and reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. parameter symbol value unit input voltage v cc -0.3 to 6 v iset pin voltage v iset -0.3 to 6 v en pin voltage v en -0.3 to 6 v feedback pin voltage v fb -0.3 to 6 v pwm pin voltage v pwm -0.3 to 6 v voltage per channel (note 2) v chx -0.3 to 40 v thermal resistance (junction to ambient, no heat sink) q ja 80 o c/w operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c esd (machine model) 200 v esd (human body model) 6000 v note 1: stresses greater than those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolute max- imum ratings" for extended periods may affect device reliability. note 2: breakdown voltage. absolute maximum ratings (note 1)
eight-channel constant current sink with current match AP3609 5 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited preliminary datasheet parameter symbol min max unit input voltage v cc 4.2 5 .5 v recommended pwm dimming frequency f pwm 0.1 25 k hz full scale setting current per channel v chx 3 0.5v i chx 10 25 ma v chx 3 1v 10 65 v chx 3 1.5v 10 110 operating temperature range t a -40 85 o c recommended operating conditions electrical characteristics parameter symbol conditions min typ max unit input section input voltage v in 4.2 5 .5 v quiescent current i q no load 0 .5 1 ma shutdown quiescent current i sdb v en =0v 0 .1 1 m a under voltage lockout threshold v uvlo falling edge 3.6 3.8 4 .0 v under voltage lockout hysteresis v huvlo 200 mv current sink section iset reference voltage v iset 1.170 1.194 1.2 18 v current multiplication ratio k i chx /i set 370 400 430 maximum output current per channel i chx_max v chx = 0.5v 23 45 ma v chx = 1v 65 70 v chx = 1.5v 1 10 120 current matching between any two channels i ch-match i chx = 60ma v chx = 1v -1.5 1 .5 % current sink saturation voltage per channel v chx_sat i chx =20ma 0.45 v i chx =60ma 0.8 i chx =100ma 1.2 output current line regulation v cc = 4.2v to 5.5v 2 %/v output current load regulation v chx =0.5v to 2.8v 4 % limits in standard typeface are guaranteed for v in =v en =5v, r iset =8k w ,, t a =25 o c, unless otherwise specified.
eight-channel constant current sink with current match AP3609 preliminary datasheet 6 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited 0 20 40 60 80 100 0 2 4 6 8 10 12 14 16 18 20 current per channel (ma) d uty cycle (%) -60 -40 - 20 0 20 40 60 80 1 00 120 140 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 current per channel (ma) t emperature ( o c) r iset =23k parameter symbol conditions min typ max unit enable section en pin high level threshold volta ge v ih_en 1.8 v en pin low level threshold volta ge v il_en 0 .8 v pwm dimming section pwm high level threshold volt age v ih_pwm 1.8 v pwm low level threshold volta ge v il_pwm 0 .8 v interface section feedback output current i fb 5 15 m a total device self-check voltage @ open led v check 3.0 v thermal shutdown temperature t otsd 160 o c thermal shutdown hysteresis t hys 20 o c electrical characteristics (continued) limits in standard typeface are guaranteed for v in =v en =5v, r iset =8k w ,, t a =25 o c, unless otherwise specified. typical performance characteristics v in =v en =5v, r iset =8k w ,, t a =25 o c, unless otherwise specified. figure 4. current per channel vs. temperature figure 5. current per channel vs. duty cycle
eight-channel constant current sink with current match AP3609 7 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited preliminary datasheet 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 59.0 59.5 60.0 60.5 61.0 current per channel (ma) i nput voltage (v) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 59.0 59.5 60.0 60.5 61.0 current per channel (ma) vol tage per channel (v) figure 6. current per channel vs. input voltage figure 7. current per channel vs. voltage per channel typical performance characteristics (continued) v in =v en =5v, r iset =8k w ,, t a =25 o c, unless otherwise specified. 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 20 40 60 80 100 120 140 maximum output current (ma) vol tage per channel (v) figure 8. maximum output current vs. voltage per channel figure 9. feedback voltage vs. feedback current 0.000 0.002 0. 004 0. 006 0. 008 0. 010 0. 012 0.0 14 0.016 0.018 0.0 0.1 0.2 0.3 0.4 0.5 feedback voltage (v) f eedback current (ma)
eight-channel constant current sink with current match AP3609 preliminary datasheet 8 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited function description the AP3609 is designed for led display application which contains eight well-matched current sinks to provide constant current through led. the full scale led current can be adjusted from 10ma to 100ma per channel with an external resistor. if there is some channel unused, the channel pin should be connected to ground. the led bright dimming can be achieved through pwm dimming. the AP3609 can work with a dc/dc converter to drive led arrays for good performance. the device can keep working when led opens without damage, and it features under voltage lockout protection and over temperature protection. the detailed information will be discussed in open led self-check and protection section. 1. led current setting the maximum led current can be set up to 100ma per channel by iset pin. when the led current is greater than 100ma, two or more channels can be par- alleled to achieve larger drive current. to set the reference current i set , connect a resistor r iset between this pin and ground. the value of r iset can be calculated by the following formula: this reference current is multiplied internally with a gain (k) of 400, and then mirrored on all enabled channels. this sets the maximum led current, referred to as 100% current (i chx_max ). the value can be calculated by the following formula: the led current can be reduced from 100% by pwm dimming control. 2. pwm dimming mode the led current can be adjusted by applying the pwm signal to pwm pin. on this mode, all enabled channels are adjusted at the same time and the brightness can be adjusted from 1%*i chx_max to 100%*i chx_max (@f dimming =2khz). during the "high level" time of the pwm signal, the led turns on and the 100% current flows through led. during the "low level" time of the pwm signal, the led turns off and almost no current flows through led. so the average current through led is changed and the brightness is adjusted. the external pwm signal frequency applied to pwm pin can be allowed to 100hz or higher. an example for pwm dimming is shown in figure 10. all 8 channels are set to the maximum current i chx_max at the beginning. when a 50% duty cycle pwm signal is applied to pwm pin, average current valued 50%* i chx_max flows through the 8 channels. when an 80% duty cycle pwm signal is applied to pwm pin, average current valued 80%*i chx_max flows through the 8 channels. iset set rv 1941i /. = set max ch ik i = x_ figure 10. pwm dimming example of AP3609 pwm 50% duty cycle ch1...ch8 current 8 0% duty cycle 0 0 i ch_max i ch_max i ch_max
eight-channel constant current sink with current match AP3609 9 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited preliminary datasheet function description (continued) 3. open led self-check and protection the AP3609 can work with a dc/dc converter to achieve good performance, such as self-check and protection against open led. the fb pin samples voltage of each channel, and outputs the lowest voltage to dc/dc converter. when AP3609 gets shutdown signal from en pin or pwm voltage is low, AP3609 outputs a high z signal (floating). the fb voltage should be decided by external pull-up resistor connected to it. then the dc/dc converter can be controlled by AP3609. if any enabled led string opens, voltage on the corresponding chx pin goes to zero and the fb pin outputs the zero voltage to boost converter. so the boost converter operates in open loop and the voltage on remaining chx pin goes higher. once the voltage on remaining chx pin reaches the self-check voltage 3v, the AP3609 begins looking up the open string. after finding the open channel, AP3609 removes the corresponding chx pin from boost control loop, then the boost circuit is controlled in the normal manner. once the circuit returns normal operation, the voltage on the chx pin is regulated to the normal level. it is necessary to pay attention that the open strings are removed from boost regulation, but not disabled. if the open led string is reconnected, it will sink current up to the programmed current level. 4. parallel operation mode the AP3609 can be paralleled to drive more strings of led. connecting an AP3609 fb pin with another AP3609 fbx pin can achieve parallel application. more details please refer to figure 11.
eight-channel constant current sink with current match AP3609 preliminary datasheet 10 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited typical application figure 11. typical applications of AP3609 l1 q dtc e1 vcc gnd output ctrl ref v ref v ref v fb from AP3609 u1 az7500f c1 ea2 ea1 feedback ovp v in ch1 ch2 ch3 ch4 ch5 ch6 ch7 ch8 pgnd pwm fbx fb iset agnd vcc en pwm dimming control from cascade AP3609 fb signal or float to 7500f fb signal + _ 5v v o u2 AP3609 paralleled channels single channel l1 q dtc e1 vcc gnd output ctrl ref v ref v ref v fb from AP3609 u1 az7500f c 1 ea 2 ea1 feedback ovp v in ch1 ch2 ch3 ch4 ch5 ch6 ch7 ch8 pgnd pwm fbx fb i set agnd vcc en pwm dimming control from cascade AP3609 fb signal or float to 7500f fb signal + _ 5v v o u2 AP3609 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 3 456 78 9 10 11 12 13 14 15 16 2
eight-channel constant current sink with current match AP3609 11 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited preliminary datasheet mechanical dimensions soic-16 unit: mm(inch) 7 9 . 8 0 0 ( 0 . 3 8 6 ) 1 0 . 2 0 0 ( 0 . 4 0 2 ) 5.800(0.228) 6.240(0.246) 0.310(0.012) 0.510(0.020) 20:1 a d1 7 0 8 b c 1 . 0 0 0 ( 0 . 0 3 9 ) s 1.000(0.039) 0.200(0.008) 20:1 b c 50:1 c-c 0 . 2 0 0 ( 0 . 0 0 8 ) 0 . 2 5 0 ( 0 . 0 1 0 ) 0 .400(0.016) 1.270(0.050) 0 . 2 5 0 ( 0 . 0 1 0 ) 1.270(0.050) bsc depth 0.200(0.008) 0 . 2 5 0 ( 0 . 0 1 0 ) 0 . 0 5 0 ( 0 . 0 0 2 ) r 0 .200(0.008) r 0.200(0.008) 0 . 1 7 0 ( 0 . 0 0 7 ) 0 . 2 5 0 ( 0 . 0 1 0 ) a 3.800(0.150) 4.040(0.159) 3 8 9 . 5 8 8 7 0.400(0.016) 45 note: eject hole, oriented hole and mold mark is optional. d 0.150(0.006) 0.070(0.003) 0.070(0.003) . symbol d d1 min(mm) max(mm) max(mm) min(mm) min(inch) min(inch) max(inch) max(inch) option1 option2 1.350 - 1.750 1.260 0.069 - 0.050 1.650 - 1.250 1.020 0.049 0.040 0.065 - 0.053
eight-channel constant current sink with current match AP3609 preliminary datasheet 12 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited mounting pad layout soic-16 dimensions z (mm)/(inch) g (mm)/(inch) x (mm)/(inch) y (mm)/(inch) e (mm)/(inch) value 6.900/0.27 2 3.900/0.1 54 0.650/0.026 1.500/0.05 9 1.270/0.050 z x e y g
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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